Polyimide Varnish
Description
Electrical insulation and heat resistance are excellent.
Excellent mechanical properties and long-term heat resistance.
Insoluble in all organic solvents and acids, alkaline chemicals are resistant.
Continuous operating temperature is 350 ℃, and the instantaneous and can withstand temperatures
above 400 ℃.
Application
FPC _ Polyimide Liquid Coverlay
Polyimide Liquid Coverlay : Heat cure PI (Silk screen)
Flexibility excellent, Heat resistance 280℃ over
FPC Coverlay film(2layer adhesive) with liquid PI varnish
Process
SEMICONDUCTOR _ MEMS process
Semiconductor : Wafer and Ceramic, Glass substrate
Buffer coat, LSI, Passivation layer
Optics cable, Vacuum equipment, IC test socket, etc
SEMICONDUCTOR & PACKAGE SUBSTRATE_ PI Pad
Semiconductor : Wafer Jig and etc..,
Package substrate : Jig and pad
