Polyimide Varnish and Polyimide Liquid Coverlay

Polyimide Varnish

Description

  • Electrical insulation and heat resistance are excellent.
  • Excellent mechanical properties and long-term heat resistance.
  • Insoluble in all organic solvents and acids, alkaline chemicals are resistant.
  • Continuous operating temperature is 350 ℃, and the instantaneous and can withstand temperatures above 400 ℃.
  • Application

    FPC _ Polyimide Liquid Coverlay

  • Polyimide Liquid Coverlay : Heat cure PI (Silk screen)
  • Flexibility excellent, Heat resistance 280℃ over
  • FPC Coverlay film(2layer adhesive) with liquid PI varnish
  • Process

    SEMICONDUCTOR _ MEMS process

  • Semiconductor : Wafer and Ceramic, Glass substrate
  • Buffer coat, LSI, Passivation layer
  • Optics cable, Vacuum equipment, IC test socket, etc
  • SEMICONDUCTOR & PACKAGE SUBSTRATE_ PI Pad

  • Semiconductor : Wafer Jig and etc..,
  • Package substrate : Jig and pad